Ultra-compact SSD in BGA package, soldered directly to the PCB with no connector, combining PCIe Gen3 NVMe performance (up to 32 Gb/s) with 20–240 GB capacities in a 16x20x1.6 mm footprint. Built for shock, vibration and extended temperature range (-40°C to +85°C) in space-constrained embedded, IIoT and medical designs.